The institute yesterday (13) days dimmable with color temperature LED indoor person because of the lighting system, Android somatosensory remote control technology "and other R & D results will be published in this year's Taipei International Invention Show. The lighting system provides people to achieve energy efficiency goals and to shape a comfortable working environment lighting; somatosensory remote technology so that Android phone can "play games, manipulate remote vehicle, voice-activated appliances", suddenly become somatosensory remote control device, or even make the set-top box manufacturers to find the killer application for lives more convenient and fun.
ITRI Green Energy and Environment Research Institute, said the T-5 lamp light source lamps, dimmable with color temperature LED interior lighting system to replace the existing use, compared with fluorescent lamps, LED lamps use performance not only increased by 40%, also has no mercury environmental characteristics, and even life of up to more than sixty thousand hours and more affordable than the 25,000 hours of fluorescent lamps.
As for Android somatosensory remote control technology can be used with a variety of body touched for playing the wisdom of video games, remote control toy car, even voice-activated appliances, only the software built-in set-top boxes, and then through the Android phone to download and install the somatosensory remote APP after phone will be able to and the TV connected to the line, using the phone's built-in touch and G Sensor function, intelligent combination of so-top boxes and mobile phones, the experience of thousands of Android market game.
LED Diode, LED Numeric Display, LED Alphanumeric Display, LED Dot Matrix Display, LED Digit Display, LED Bar Graph Display
Friday, September 21, 2012
Tuesday, September 18, 2012
LED Production Process
In order to develop blue high brightness LED, around the world related research staff are committed. While the commercial application shows the III V group elements as potential. In the current commercial LED material and its extension, the red and green light emitting diode epitaxial technique for liquid phase epitaxial growth of most main method, while the yellow, orange light emitting diode at present still with gas phase epitaxial growth techniques of gallium arsenide GaAsP materials.
GaN growth need high temperature to interrupt the NH3 N-H key solution, on the other hand by dynamic simulation also learned that the NH3 and MO Gas will react to produce no volatile byproducts.
LED LED epitaxial wafer process is as follows:
Substrate structure design of buffer layer growth - N GaN layer growth - multiple quantum well light emitting layer of P type GaN layer growth - annealing - Detection ( fluorescence, X ray ) - LED epitaxial wafers
LED epitaxial wafer - design, processing mask - lithography - ion etching N type electrode ( plating, annealing, etching ) - P type electrode ( plating, annealing, etching ) - scribing - chip sorting, grading
Specific introduction:
Fixed: monocrystalline silicon rods fixed on the working bench.
Slice: monocrystalline silicon rod into precise geometry of thin silicon.
Annealing: duplex thermal oxidation furnace with nitrogen purge, infrared heating to 300~500℃, silicon surface reacts with oxygen to form protective layer of silicon dioxide, silicon surface.
Chamfer: annealed wafer trim into a circular shape, prevent the wafer edge rupture and lattice defects, increase the epitaxial layer and a photoresist layer smoothness.
Classification and detection: to ensure the wafer specifications and quality, to detect.
Grinding: grinding agent to remove slicing and grinding wheel made mark and surface damage layer, effectively improve the silicon wafer curvature, flatness and parallelism.
Cleaning: through organic solvent which dissolves, combined with ultrasonic cleaning technology for removal of organic impurities in silicon surface.
RCA cleaning: cleaning to remove silicon surface through a variety of particulate material and metal ions.
The specific process:
Cleaning: SPM by H2SO4 solution and H2O2 solution according to the proportion of SPM solution, the metal oxide dissolved in the cleaning liquid, and the organic pollutant is oxidized into CO2 and H2O.
DHF: cleaning with hydrofluoric acid with a certain concentration removal from silicon wafer surface in the natural oxide film, and attached to the natural oxide film on the metal is dissolved into the cleaning fluid, while DHF inhibits the formation of an oxide film.
APM: APM cleaning solution by a certain proportion of NH4OH solution, H2O2 solution composition, silicon surface due to oxidation oxide film on H2O2 ( about 6nm in hydrophilic ), the film was NH4OH corrosion, corrosion and oxidation occurs immediately after, repeated, attached to the surface of the silicon wafer particles and metal with corrosion layer and into the cleaning liquid. Cleaning: HPM by HCl solution and H2O2 solution according to the proportion of HPM, the removal of silicon surface sodium, iron, magnesium and zinc.
DHF cleaning: removes a procedure in the silicon surface oxide film. Grinding test: detection after grinding, RCA after cleaning the wafer quality, do not meet the requirements from the new RCA grinding and cleaning.
Corrosion of A/B: through slicing and grinding machining, the wafer surface by processing stress and the formation of the damaged layer, usually by chemical etching to remove. Corrosion of A is corrosive acid, mixed acid solution to remove damage layer, to produce hydrogen fluoride, NOX and waste mixed acid; corrosion B is an alkaline corrosion, using sodium hydroxide solution to remove damage layer, produce waste lye. The part of a program using A silicon corrosion, partly by the corrosion B.
Classified monitoring: the silicon wafer for damage detection, there is damage to the corrosion of silicon.
Rough polishing: use a grinding agent to remove the damaged layer.
Polishing: using grinding agent to improve the silicon surface micro roughness.
Inspection: check whether it meets the requirements of silicon wafers.
Detection: view the silicon surface is clean.
Packaging: monocrystalline silicon polished wafers for packaging.
LED Diode, LED Numeric Display, LED Alphanumeric Display, LED Dot Matrix Display, LED Digit Display, LED Bar Graph Display
GaN growth need high temperature to interrupt the NH3 N-H key solution, on the other hand by dynamic simulation also learned that the NH3 and MO Gas will react to produce no volatile byproducts.
LED LED epitaxial wafer process is as follows:
Substrate structure design of buffer layer growth - N GaN layer growth - multiple quantum well light emitting layer of P type GaN layer growth - annealing - Detection ( fluorescence, X ray ) - LED epitaxial wafers
LED epitaxial wafer - design, processing mask - lithography - ion etching N type electrode ( plating, annealing, etching ) - P type electrode ( plating, annealing, etching ) - scribing - chip sorting, grading
Specific introduction:
Fixed: monocrystalline silicon rods fixed on the working bench.
Slice: monocrystalline silicon rod into precise geometry of thin silicon.
Annealing: duplex thermal oxidation furnace with nitrogen purge, infrared heating to 300~500℃, silicon surface reacts with oxygen to form protective layer of silicon dioxide, silicon surface.
Chamfer: annealed wafer trim into a circular shape, prevent the wafer edge rupture and lattice defects, increase the epitaxial layer and a photoresist layer smoothness.
Classification and detection: to ensure the wafer specifications and quality, to detect.
Grinding: grinding agent to remove slicing and grinding wheel made mark and surface damage layer, effectively improve the silicon wafer curvature, flatness and parallelism.
Cleaning: through organic solvent which dissolves, combined with ultrasonic cleaning technology for removal of organic impurities in silicon surface.
RCA cleaning: cleaning to remove silicon surface through a variety of particulate material and metal ions.
The specific process:
Cleaning: SPM by H2SO4 solution and H2O2 solution according to the proportion of SPM solution, the metal oxide dissolved in the cleaning liquid, and the organic pollutant is oxidized into CO2 and H2O.
DHF: cleaning with hydrofluoric acid with a certain concentration removal from silicon wafer surface in the natural oxide film, and attached to the natural oxide film on the metal is dissolved into the cleaning fluid, while DHF inhibits the formation of an oxide film.
APM: APM cleaning solution by a certain proportion of NH4OH solution, H2O2 solution composition, silicon surface due to oxidation oxide film on H2O2 ( about 6nm in hydrophilic ), the film was NH4OH corrosion, corrosion and oxidation occurs immediately after, repeated, attached to the surface of the silicon wafer particles and metal with corrosion layer and into the cleaning liquid. Cleaning: HPM by HCl solution and H2O2 solution according to the proportion of HPM, the removal of silicon surface sodium, iron, magnesium and zinc.
DHF cleaning: removes a procedure in the silicon surface oxide film. Grinding test: detection after grinding, RCA after cleaning the wafer quality, do not meet the requirements from the new RCA grinding and cleaning.
Corrosion of A/B: through slicing and grinding machining, the wafer surface by processing stress and the formation of the damaged layer, usually by chemical etching to remove. Corrosion of A is corrosive acid, mixed acid solution to remove damage layer, to produce hydrogen fluoride, NOX and waste mixed acid; corrosion B is an alkaline corrosion, using sodium hydroxide solution to remove damage layer, produce waste lye. The part of a program using A silicon corrosion, partly by the corrosion B.
Classified monitoring: the silicon wafer for damage detection, there is damage to the corrosion of silicon.
Rough polishing: use a grinding agent to remove the damaged layer.
Polishing: using grinding agent to improve the silicon surface micro roughness.
Inspection: check whether it meets the requirements of silicon wafers.
Detection: view the silicon surface is clean.
Packaging: monocrystalline silicon polished wafers for packaging.
LED Diode, LED Numeric Display, LED Alphanumeric Display, LED Dot Matrix Display, LED Digit Display, LED Bar Graph Display
Wednesday, September 12, 2012
LED Sign
Excellent visibility, even in daylight
Super bright LED Open Sign
RoHS
Super bright LEDs
Place for usage: Supermarkets, shopping mall, stores, shops, hotels, motels, restaurants, clubs, bars or any place as you like.
Be More Convenient for Customer's Display or Advertising.
Want to attract customer's attention and send a message, Send the right message clearly and effectively with a brave, bold LED SIGN in vivid flashing excitement. In these 'glance and go' times, your business can take advantage of LED Sign get the point across fast!
Specific parameters, please refer to the product specifications in PDF format.
LED Diode, LED Numeric Display, LED Alphanumeric Display, LED Dot Matrix Display, LED Digit Display, LED Bar Graph Display
Super bright LED Open Sign
RoHS
Super bright LEDs
Place for usage: Supermarkets, shopping mall, stores, shops, hotels, motels, restaurants, clubs, bars or any place as you like.
Be More Convenient for Customer's Display or Advertising.
Want to attract customer's attention and send a message, Send the right message clearly and effectively with a brave, bold LED SIGN in vivid flashing excitement. In these 'glance and go' times, your business can take advantage of LED Sign get the point across fast!
Specific parameters, please refer to the product specifications in PDF format.
LED Diode, LED Numeric Display, LED Alphanumeric Display, LED Dot Matrix Display, LED Digit Display, LED Bar Graph Display
Sunday, September 9, 2012
Ø3 Mm LED Lamp
- Categories:
- LED Diode
- Model:
- NFL-30…
- Usage:
- Indoor
- Display Function:
- Video
- Tube Chip Color:
- All Color
- Pixels:
- ø3 mm
Ningbo Flying Electronics Co., Ltd. is a professional LED component manufacturer . Our products cover LED lamp(light emitting diode), LED numeric display, LED alphanumeric display, LED dot matrix display, LED light bar, Outdoor Lamp Cluster(LED cluster) and LED applications.
Specific parameters, please refer to the product specifications in PDF format.
LED Diode, LED Numeric Display, LED Alphanumeric Display, LED Dot Matrix Display, LED Digit Display, LED Bar Graph Display
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